TMS320F28FOC / DTC11 kW
11 kW sensorless AC servo drive
Sensorless field-oriented control at 380 V and 75 A, validated on elevator traction loads from 3.3 to 7.5 kW.
Read the case studyShenzhen, China · Embedded engineering since 2016
Your engineering team in Shenzhen.
Embedded firmware, high-speed PCB and FPGA design — from concept to mass production.
We build the boards other teams turn down: 28,000-pin server mainboards, 12 Gbps signal paths, 11 kW servo drives. 200+ designs delivered since 2016, with production support that does not stop at the prototype.
Signal integrity signed off before fabrication
- DDR2/3/4
- PCIe Gen3/4
- SERDES
- SDI
- USB 3.x / OTG
- Ethernet 1G
- RS-232/422/485
- CAN / LIN
- Modbus
- I²C / SPI
- MIPI
- STM32 (F/G/H)
- TMS320F28
- nRF52
- ESP32
- i.MX
- Xilinx Artix / Kintex / Ultrascale
- Raspberry Pi CM
- Altium Designer
- Cadence Allegro
- Mentor HyperLynx
- Keysight ADS
- Vivado
- Quartus
- Libero
- Keil
- IAR
- 200+
- Designs delivered
- 18
- Max stack-up shipped (layers)
- 28,400
- Max pin count on one board
- 2016
- In operation since
Capabilities
What we do
Six capabilities, held deep rather than listed wide. Exhaustive part and platform lists live at the foot of each service page.
Proof
Selected work
Every case follows the same eight-block format — including how the design was proven before fabrication, which is the block most competitors leave out.
BLEsub-5 µAiOS + Android
Sub-5 µA BLE sensor node with companion app
A connected dosing device with flash-backed event logging, native iOS and Android apps, and idle current held below 5 µA.
Read the case study
18 layers28,400 pins24 Gbps
Super-computer mainboard
Gen4 PCIe at 24 Gbps across an 18-layer board — first fabrication passed signal integrity sign-off.
Read the case studySectors
Industries we serve
Each links to the cases published in that sector.
Process
How we work
Six stages, each with a named deliverable. This is the section that answers the real objection to an offshore team: not capability, but process opacity.
Discovery
Requirements review, feasibility, risk list
DeliverableTechnical proposal and fixed quote
Architecture
Block diagram, part selection, stack-up plan
DeliverableArchitecture document, BOM v0
Design
Schematic, layout, firmware, RTL
DeliverableSchematic review package, weekly build
Simulation and review
SI/PI simulation, DFM check, design review call
DeliverableSimulation report, DRC/DFM report
Prototype and bring-up
Fabrication, assembly, board bring-up, debug
DeliverableWorking prototype and test report
Production transfer
DFT, test jig, pilot run, supplier qualification
DeliverableFull design package — you own all files
Every project ends with a complete handover: schematics, layout source, Gerbers, firmware source, BOM with qualified alternates, and test procedures. The design is yours.
Location
Why a team in Shenzhen
We’re not hiding where we are. It’s the reason you should hire us.
The supply chain is a taxi ride away.
PCB fabrication in 48 hours. Components sourced in 3 days. A design revision that takes three weeks in Europe takes us one. When a critical IC goes end-of-life, we walk into the market and qualify an alternate the same week.
Design and manufacturing under one roof.
We don’t hand you a Gerber file and disappear. We run the DFM review with the fab, build the test jig, sit through the pilot run, and inspect the first production batch — because the factory is thirty minutes from our desks.
Datasheet
Capabilities snapshot
Check your requirements against this before you write to us.
Interfaces
- DDR2/3/4
- PCIe Gen3/4
- SERDES
- SDI
- USB 3.x / OTG
- Ethernet 1G
- RS-232/422/485
- CAN / LIN
- Modbus
- I²C / SPI
- MIPI
Platforms
- STM32 (F/G/H)
- TMS320F28
- nRF52
- ESP32
- i.MX
- Xilinx Artix / Kintex / Ultrascale
- Raspberry Pi CM
Tools
- Altium Designer
- Cadence Allegro
- Mentor HyperLynx
- Keysight ADS
- Vivado
- Quartus
- Libero
- Keil
- IAR
Verification
- S-parameter extraction
- TDR
- Eye diagram and jitter
- Crosstalk and reflection modeling
- PDN impedance
- Thermal simulation
- Max stack-up
- 18 layers
- Max pin count
- 28,400
- Max data rate
- 24 Gbps
- Max drive power
- 11 kW
Commercials
Working together
Prices are quoted per project, but the structure is not a secret.
Fixed-scope project
Best for
Well-defined boards or firmware modules
Scope, deliverables, milestones and price agreed before kickoff. Payment tied to milestone acceptance. Typical 6–16 weeks.
Dedicated team
Best for
Ongoing product lines and multi-board programs
A named team of 2–6 engineers working in your tooling, your sprint rhythm, your repo. Monthly rate. Minimum 3 months.
Design review and rescue
Best for
A board that won’t pass, a link that won’t close
We audit your existing schematic, layout or firmware and deliver a findings report with a fix plan. Typical 1–3 weeks.
Tell us what you’re building.
Send a schematic, a spec, or a rough idea. We’ll come back within one business day with an honest read on feasibility, risk, and timeline — before any commitment.